Flexible polysilicon sensor array modules using "etch-release" packaging scheme

Sensors and Actuators, A: Physical

Volumn 111, Issue 1, 2004, Pages 135-141

  Hwang, Eun Soo ^a   Kim, Yong Jun ^a   Ju, Byeong Kwon ^b  

^a Yonsei University   (South Korea)

^b Korea Institute of Science and Technology   (South Korea)

Author keywords

Flexible; Packaging; Piezporesistivity; Release etching; Sensor array; Strain gauge

Indexed keywords

ARRAYS; BOUNDARY CONDITIONS; COMPUTER SIMULATION; ETCHING; MICROMACHINING; PHOTOLITHOGRAPHY; POLYSILICON; PRINTED CIRCUIT BOARDS; SILICA; SINGLE CRYSTALS; STRAIN GAGES; STRAIN MEASUREMENT; STRESS CONCENTRATION; TENSILE STRESS;

FLEXIBLE POLYSILICON SENSOR ARRAYS; METAL STRAIN GUGES; PACKAGING SCHEMES; PIEZORESISTIVITY; RELEASE ETCHING;

SILICON SENSORS;

EID: 1042266146     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2003.10.022     Document Type: Conference Paper

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