Novel interconnection method using electrically conductive paste with fusible filler

Journal of Electronic Materials

Volumn 34, Issue 5, 2005, Pages 600-604

  Kim, Jong Min ^a,b   Yasuda, Kiyokazu ^a   Fujimoto, Kozo ^a  

^a OSAKA UNIVERSITY   (Japan)

^b Chung Ang University   (South Korea)

Author keywords

Conductive path; Electrically conductive paste; Fluxless; Low melting point alloy

Indexed keywords

ADHESION; COALESCENCE; CURING; ELECTRIC CONDUCTIVITY; ELECTRODES; MELTING; OPTICAL INTERCONNECTS; RESINS; SCANNING ELECTRON MICROSCOPY; WETTING; X RAYS;

CONDUCTIVE PATH; ELECTRICALLY CONDUCTIVE PASTE; FLUXLESS; LOW-MELTING-POINT ALLOY;

FILLERS;

EID: 20344382038     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0071-z     Document Type: Conference Paper

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