Rapid temperature cycling (RTC) methodology for reliability assessment of solder interconnection in tape ball grid array (TBGA) assembly

Journal of Electronic Packaging

Volumn 127, Issue 4, 2005, Pages 466-473

  Chen, B L ^a   Shi, X Q ^b   Li, G Y ^a   Ang, K H ^b   Pickering, Jason P ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); RELIABILITY; SOLDERED JOINTS;

ACCELERATED TEMPERATURE CYCLING (ATC); COFFIN-MANSION EQUATION; RAPID TEMPERATURE CYCLING (RTC); TAPE BALL GRID ARRAY (TBGA);

THERMOELECTRIC EQUIPMENT;

EID: 29544438039     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2056574     Document Type: Article

References (16)

1. Lau, J., 1991, Solder Joint Reliability: Theory and Applications, Van Nostrand Reinhold, New York.
2. JEDEC (Joint Electronic Device Engineering Council) standard, 1989, Temperature cycling. JESD22-A104-A. USA: Electronic Industries Association.
3. Lau, J., and Pao, Y. H., 1997, Solder Joint Reliability of EGA, CSP, Flip Chip and Fine Pitch SMT Assemblies, McGraw-Hill, New York.
4. Sealing, S., and Dasgupta, A., 1999, "Alternative Accelerated Testing Method for Localization of Solder Fatigue Failures on Electronic Circuit Cards," ASME J. Electron. Packag., Maui, HI, USA, 26, No. 2, pp. 1593-1598.
5. Sharma, P., Natarajan, R., and Dasgupta, A., 1999, "Reducing Accelerated Test Time: Use of Vibration Loading to Accelerate Ageing Damage." ASME J. Electron. Packag., 26, No. 2, pp. 1801-1805.
6. Zubelewicz, A., Tokarz, R. F., Kuracina, R. P., and McGinniss, J. L., 1995, "Mechanical Deflection System: An Innovative Test Method for SMT Assemblies," ASME J. Electron. Packag., 10, No. 2, pp. 1167-1177.
7. Pang, H. L. J., Ang, K. H., Wang, Z. P., and Shi, X. Q., 1999, "Reliability Test Methodology Using Thermo-Mechanical Deflection," ASME J. Electron. Packag., 26, No. 2, pp. 2077-2082.
8. Shi, X. Q., Pang, H. L. J., Yang, Q. J., Wang, Z. P., and Nie, J. X., 2002, "Quick Assessment Methodology for Reliability of Solder Joints in Ball Grid Array (BGA) Assembly-Part II: Reliability Experiment and Numerical Simulation," Acta Mech. Sin., 18, No. 4, pp. 356-367.
9. Towashiraporn, P., Subbarayan, G., McIlvanie, B., Hunter, B. C., Love, D., and Sullivan, B., 2004, "The Effect of Model Building on the Accuracy of Fatigue Life Predictions in Electronic Packages," Microelectron. Reliab., 44, pp. 115-127.
10. Qi, Q., 2001, "Reliability Studies of Two Flip-Chip BGA Packages Using Power Cycling Test," Microelectron. Reliab., 41, No. 4, pp. 553-562.
11. Clech, J. P. M., Noctor, D. M., Manock, J. C., Lynott, G. W., and Bader, F. E., 1994, "Surface Mount Assembly Failure Statistics and Failure Free Time," 44th Electronic Components and Technology Conference, Washington, D. C., pp. 487-497.
12. Kumar, U. D., Crocker, J., Knezevic, J., and Ei-Haraam, M., 2000, Reliability Maintenance and Logistic Support: A Life Cycle Approach, Kluwer Academic, Dordrecht, Chap. 2, pp. 13-49.
13. Pecht, M., 1991, Handbook of Electronic Package Design, Marcel Dekker, New York.
14. Darveaux, R., and Banerji, K., 1992, "Constitutive Relations for Tin-Based Solder Joints," IEEE Trans. Compon., Hybrids, Manuf. Technol., 15, No. 6, pp. 1013-1024.
15. Meyers, M. A., and Chawla, K. K., 1984, Mechanical Metallurgy: Principles and Applications, Prentice-Hall, New Jersey.
16. Shi, X. Q., Pang, H. L. J., Zhou, W., and Wang, Z. P., 2000, "Low Cycle Fatigue Analysis of Temperature and Frequency Effects in Eutectic Solder Alloy," Int. J. Fatigue, 22, pp. 217-228.