Electroplated metal microstructures embedded in fusion-bonded silicon: Conductors and magnetic materials

Journal of Microelectromechanical Systems

Volumn 13, Issue 5, 2004, Pages 791-798

  Arnold, David P ^a   Cros, Florent ^a   Zana, Iulica ^a   Veazie, David R ^b   Allen, Mark G ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b CLARK ATLANTA UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BOND STRENGTH (MATERIALS); COPPER; ELECTRIC CONDUCTORS; ELECTROPLATING; ENCAPSULATION; MAGNETIC MATERIALS; NICKEL ALLOYS; SILICON WAFERS;

ELECTROPLATED METAL MICROSTRUCTURES; FUSION BONDED SILICON; PERMALLOY; WAFER BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 7244229998     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2004.835770     Document Type: Article

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