Microfabrication of high-temperature silicon devices using wafer bonding and deep reactive ion etching

Journal of Microelectromechanical Systems

Volumn 8, Issue 2, 1999, Pages 152-160

  Mehra, Amit ^a   Ayón, Arturo A ^b   Waitz, Ian A ^a   Schmidt, Martin A ^b  

^a USA   (United States)

^b NONE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMBUSTION; FUEL INJECTION; GAS ENGINES; HIGH TEMPERATURE OPERATIONS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; OXIDATION; REACTIVE ION ETCHING; SILICON WAFERS;

ALIGNED FUSION BONDING; FUEL INJECTOR; HIGH TEMPERATURE SILICON DEVICES; HYDROGEN AIR COMBUSTION; MICRO HEAT ENGINE; MICROCOMBUSTOR; SILICON CREEP; SILICON OXIDATION; TURBINE INLET TEMPERATURE;

COMBUSTORS;

EID: 0345325567     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.767111     Document Type: Article

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