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Journal of the Electrochemical Society

Volumn 157, Issue 1, 2010, Pages

A numerical study of thermal and electrical effects in a vertical LED chip

(6) Hwu, Farn Shiun a Chen, Jyh Chen a Tu, Sheng Han b Sheu, Gwo Jiun a Chen, Hsueh I a Sheu, Jinn Kong c

a NATIONAL CENTRAL UNIVERSITY (Taiwan)

b NANYA INSTITUTE OF TECHNOLOGY (Taiwan)

c NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE LAYER; CURRENT BLOCKING LAYERS; CURRENT CROWDING; CURRENT DENSITY DISTRIBUTION; ELECTRICAL CHARACTERISTIC; ELECTRICAL EFFECTS; EMITTING AREAS; EXPERIMENTAL DATA; FORWARD VOLTAGE; HOT SPOT; LED CHIPS; NUMERICAL SIMULATION; NUMERICAL STUDIES; UNIFORM TEMPERATURE; WALLPLUG EFFICIENCY;

COMPUTER SIMULATION; GALLIUM ALLOYS; GALLIUM NITRIDE; GLASS INDUSTRY; LIGHT EMISSION; LIGHT EMITTING DIODES; PHYSICAL OPTICS; SEMICONDUCTING GALLIUM; TEMPERATURE DISTRIBUTION;

ORGANIC LIGHT EMITTING DIODES (OLED);

EID: 72249111782 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.3246784 Document Type: Article

Times cited : (29)

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