Anisotropic deposition of localized electroless nickel for preferential bridge connection

Journal of the Electrochemical Society

Volumn 157, Issue 1, 2010, Pages

  Yokoshima, Tokihiko ^a   Yamaji, Yasuhiro ^a   Kikuchi, Katsuya ^a   Nakagawa, Hiroshi ^a   Aoyagi, Masahiro ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPIC DEPOSITION; BRIDGE CONNECTIONS; ELECTROLESS; ELECTROLESS DEPOSITION; ELECTROLESS NICKEL; HIGH THROUGHPUT; MASKLESS FABRICATION; ORGANIC SURFACES; PAD ARRAYS; RESIST PATTERN; SELECTIVE DEPOSITION; SOLUTION-DIFFUSION;

ANISOTROPY; ELECTROLESS PLATING; FABRICATION; FACINGS; PHOTORESISTS;

DEPOSITION;

EID: 72249091516     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3254174     Document Type: Article

References (30)

1. http://www.itrs.net/Links/2007ITRS/ExecSum2007.pdf, last accessed 2007.
2. J. U. Knickerbocker, P. S. Andry, L. P. Buchwalter, A. Deutsch, R. R. Horton, K. A. Jenkins, Y. H. Kwark, G. McVicker, C. S. Patel, R. J. Polastre, IBM J. Res. Dev. 0018-8646, 49, 725 (2005).
3. K. Takahashi, M. Umemoto, N. Tanaka, K. Tanida, Y. Nemoto, Y. Tomita, M. Tago, and M. Bonkohara, Microelectron. Reliab. 0026-2714, 43, 1267 (2003). 10.1016/S0026-2714(03)00167-7
4. K. Kikuchi, S. Segawa, E. -S. Jung, Y. Nemoto, M. Umemoto, H. Nakagawa, K. Tokoro, and M. Aoyagi, Jpn. J. Appl. Phys., Part 1 0021-4922, 43, 4141 (2004). 10.1143/JJAP.43.4141
5. K. Tanida, M. Umemoto, T. Morifuji, R. Kajiwara, Y. Tomita, N. Tanaka, and K. Takahashi, Jpn. J. Appl. Phys., Part 1 0021-4922, 42, 6390 (2003). 10.1143/JJAP.42.6390
6. Y. Tomita, T. Morifuji, M. Tomisaka, S. Sunohara, Y. Nemoto, T. Sato, K. Takahashi, and M. Bonkohara, J. Chem. Eng. Jpn. 0021-9592, 36, 119 (2003). 10.1252/jcej.36.119 (Pubitemid 36971592)
7. T. H. Kim, M. M. R. Howlader, T. Itoh, and T. Suga, J. Vac. Sci. Technol. A 0734-2101, 21, 449 (2003). 10.1116/1.1537716
8. A. He, T. Osborn, S. A. B. Allen, and P. A. Kohl, Electrochem. Solid-State Lett. 1099-0062, 9, C192 (2006). 10.1149/1.2353905 (Pubitemid 44652651)
9. T. Osborn, A. He, N. Galiba, and P. A. Kohl, J. Electrochem. Soc. 0013-4651, 155, D308 (2008). 10.1149/1.2839007 (Pubitemid 351357504)
10. A. He, T. Osborn, S. A. B. Allen, and P. A. Kohl, J. Electrochem. Soc. 0013-4651, 155, D314 (2008). 10.1149/1.2839014 (Pubitemid 351357505)
11. T. Yoda and S. Akagawa, in Proceedings of Microelectronics Symposium 2006, Japan Institute of Electronics Packaging, p. 319 (2006).
12. T. Yokoshima, Y. Yamaji, H. Oosato, Y. Tamura, K. Kikuchi, H. Nakagawa, and M. Aoyagi, Electrochem. Solid-State Lett. 1099-0062, 10, D92 (2007). 10.1149/1.2752455 (Pubitemid 47118688)
13. Y. Yamaji, T. Yokoshima, H. Oosato, N. Igawa, Y. Tamura, K. Kikuchi, H. Nakagawa, and M. Aoyagi, in Proceedings of the 57th Electronic Components and Technology Conference, The IEEE Components, Packaging and Manufacturing Technology Society and The Electronics Components Association, p. 898 (2007).
14. Y. Yamaji, T. Yokoshima, N. Igawa, Y. Tamura, K. Kikuchi, H. Nakagawa, and M. Aoyagi, IEICE Trans. Electron. 0916-8524, J91-C, 595 (2008).
15. Y. Yamaji, T. Yokoshima, N. Igawa, K. Kikuchi, H. Nakagawa, and M. Aoyagi, in Proceedings of EPTC 2008 (10th Electronics Packaging Technology Conference), The IEEE Reliability/CPMT/ED Singapore Chapter, p. 569 (2008).
16. Y. Yamaji, T. Yokoshima, K. Kikuchi, H. Nakagawa, and M. Aoyagi, IEICE Electron. Express 1349-2543, 5, 732 (2008). 10.1587/elex.5.732
17. H. Honma, H. Watanabe, and T. Kobayashi, J. Electrochem. Soc. 0013-4651, 141, 1791 (1994). 10.1149/1.2055006
18. H. Watanabe and H. Honma, J. Electrochem. Soc. 0013-4651, 144, 471 (1997). 10.1149/1.1837434
19. M. Takai, S. Takefusa, T. Yokoshima, and T. Osaka, J. Surf. Finish. Soc. Jpn. 0915-1869, 48, 98 (1997).
20. M. Takai, S. Takefusa, T. Yokoshima, and T. Osaka, in Fundamental Aspects of Electrochemical Deposition and Dissolution Including Modeling, M. Pounovic, M. Datta, M. Matlosz, T. Osaka, and, J. B. Talbot, Editors, PV 97-27, p. 358, The Electrochemical Society Proceedings Series, Pennington, NJ (1998).
21. T. Yokoshima, H. Yuasa, M. Kim, and T. Osaka, J. Surf. Finish. Soc. Jpn. 0915-1869, 49, 1336 (1998).
22. H. Honma and T. Fujinami, Circuit Technology (presently J. Jpn. Institute of Electronics Packaging), 6, 259 (1991).
23. H. Watanabe, Y. Igarashi, and H. Honma, J. Jpn. Institute for Interconnecting and Packaging Electronics Circuits (presently J. Jpn. Institute of Electronics Packaging), 12, 231 (1997).
24. T. Yokoshima, D. Kaneko, T. Osaka, S. Takefusa, and M. Oshiki, J. Magn. Soc. Jpn. 0285-0192, 23, 1397 (1999). 10.3379/jmsjmag.23.1397
25. T. Yokoshima, S. Nakamura, D. Kaneko, T. Osaka, S. Takefusa, and A. Tanaka, J. Electrochem. Soc. 0013-4651, 149, C375 (2002). 10.1149/1.1485081 (Pubitemid 34962452)
26. J. E. A. M. van den Meerakker, J. Appl. Electrochem. 0021-891X, 11, 395 (1981). 10.1007/BF00613960
27. T. Homma, A. Tamaki, H. Nakai, and T. Osaka, J. Electroanal. Chem. 0022-0728, 559, 131 (2003). 10.1016/S0022-0728(03)00042-1
28. M. Hasegawa, Y. Okinaka, Y. Shacham-Diamand, and T. Osaka, Electrochem. Solid-State Lett. 1099-0062, 9, C138 (2006). 10.1149/1.2206008 (Pubitemid 43941624)
29. A. M. T. van der Putten and J. W. G. de Bakker, J. Electrochem. Soc. 0013-4651, 140, 2221 (1993). 10.1149/1.2220799
30. A. M. T. van der Putten and J. W. G. de Bakker, J. Electrochem. Soc. 0013-4651, 140, 2229 (1993). 10.1149/1.2220800