Solder ball attachment assessment of reballed plastic ball grid array packages

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 4, 2009, Pages 901-908

  Nie, Lei ^a   Osterman, Michael ^a   Song, Fubin ^b   Lo, Jeffery ^b   Lee, S W Ricky ^b   Pecht, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Ball grid array packages; Ball shear; Cold bump pull; Lead free; Reballing; SnPb

Indexed keywords

AEROSPACE EQUIPMENTS; AGING CONDITIONS; ARRAY PACKAGES; BALL GRID ARRAY PACKAGES; BALL SHEAR; BALL-SHEAR TEST; ELECTRONIC COMPONENT; ISOTHERMAL AGING; LEAD FREE SOLDERS; LEAD-FREE; LEAD-FREE BALLS; PLASTIC BALL GRID ARRAYS; PULL STRENGTH; SOLDER BALLS; STRENGTH DISTRIBUTION; TIN-LEAD; TIN-LEAD SOLDERS;

BALL GRID ARRAYS; CHLORINATION; CONSUMER ELECTRONICS; CONTEXT SENSITIVE GRAMMARS; ELECTRONICS PACKAGING; IMPACT STRENGTH; METAL RECOVERY; PACKAGING; SOLDERED JOINTS; SOLDERING; SPHERES; TIN;

LEAD;

EID: 72149133083     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2021392     Document Type: Article

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