Investigation on powder metallurgy Cr-Si-Ta-Al alloy target for high-resistance thin film resistors with low temperature coefficient of resistance

Materials and Design

Volumn 31, Issue 3, 2010, Pages 1302-1307

  Wang, X Y ^a   Zhang, Z S ^a   Bai, T ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

Casting; Electrical properties; Grain refining; Powder metallurgy

Indexed keywords

AL ALLOYS; ALLOY TARGET; ELECTRICAL PROPERTY; GRAIN REFINING; INTERNAL STRESS; LOW TEMPERATURE COEFFICIENTS; SPUTTERED THIN FILMS; SPUTTERING TARGET; TEMPERATURE COEFFICIENT OF RESISTANCE; TEMPERATURE DROPS; THIN FILM RESISTORS; VALVE METAL;

ALUMINUM; ALUMINUM POWDER METALLURGY; CHROMIUM; ELECTRIC PROPERTIES; ELECTRIC REACTORS; GRAIN REFINEMENT; METAL REFINING; POWDER METALS; RESISTORS; SILICON; SILICON ALLOYS; SMELTING; TANTALUM; TARGETS; THERMAL CONDUCTIVITY OF SOLIDS; THIN FILM DEVICES; THIN FILMS; X RAY DIFFRACTION;

FILM PREPARATION;

EID: 72049092935     PISSN: 02641275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matdes.2009.09.012     Document Type: Article

References (15)

1. 2 thin films by vacuum arc plasma evaporation. Thin Solid Films 496 (2006) 136
2. 2 cermet thin film resistors. J Mater Sci 35 (2000) 2557
3. 2 thin film on quartz glass and MgO(1 0 0) by electron beam evaporation. Solid State Ionics 172 (2004) 293
4. Milton O. Materials science of thin films: deposition and structure. 2nd ed. (2002), Academic Press, USA p. 95
5. Zhang Y.Q., Dong X.P., and Wu J.S. Microstructure and electrical characteristics of Cr-Si-Ni films deposited on glass and Si(1 0 0) substrates by RF magnetron sputtering. Mater Sci Eng B 113 (2004) 154
6. Seema V., Vyas H.P., Muraleedharan K., and Vankar V.D. Ni-Cr thin film resistor fabrication for GaAs monolithic microwave integrated circuits. Thin Solid Films 514 (2006) 52
7. Tiana H.Y., Wanga B.Y., Wa H.L., Chana C.L., and Choya K.S. Structural and electrical characteristics of highly textured oxidation-free Ru thin films by DC magnetron sputtering. J Alloys Compd 392 (2005) 231
8. Dong X.P., and Wu J.S. Formation of an intermetallic phase by crystallization in the Cr-Si-Ni-Al amorphous film. J Alloys Compd 359 (2003) 256
9. Cheng G.G., and Cao W.Z. Electrolytic capacitors. 1st ed. (1993), Xi'an Jiaotong University Press, China p. 53
10. Rhines F.N. Phase diagrams in metallurgy (1956), McGraw-Hill Comp. p. 87
11. Hall E.O. The deformation and aging of mild steel. Proc Roy Soc London B 64 (1951) 747
12. Petch N.J. The cleavage strength of polycrystals. J Iron Steel Inst 174 (1953) 25
13. Wang M.X., Liu Z.Y., Liu Z.X., Song T.F., Weng Y.G., and Fan G.X. Analysis of grain refinement of titanium added to commercial pure aluminum by electrolysis. Light Met 12 (2003) 43
14. Kong G., Lu J.T., and Xu Q.Y. Refinement of intermetallic compounds of Zn-2Ni alloy. Chin J Nonferrous Met 16 (2006) 657
15. Park I.S., Park S.Y., Jeong G.H., Na S.M., and Suh S.J. Fabrication of Ta3N5-Ag nanocomposite thin films with high resistivity and near-zero temperature coefficient of resistance. Thin Solid Films 516 (2008) 5409