Progress in thermal characterisation methods and thermal interface technology within the "Nanopack" project

15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009

Volumn , Issue , 2009, Pages 224-232

  Wunderle, B ^a,b   Abo Ras, M ^a,c   Klein, M ^a   Mrossko, R ^a   Engelmann, G ^a   May, D ^a   Wittler, O ^a   Schacht, R ^a,d   Dietrich, L ^a   Oppermann, H ^a   Michel, B ^a  

^a FRAUNHOFER IZM   (Germany)

^b CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^c BERLINER NANOTEST UND DESIGN GMBH   (Germany)

^d Lausitz University of Applied Sciences   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ENHANCED SURFACE; HIGH-POWER; INTERFACE TECHNOLOGY; NEW PROCESS; TECHNOLOGICAL ADVANCES; TEST STANDS; THERMAL CHARACTERISATION; THERMAL INTERFACES; THERMAL RESISTANCE; THERMAL SOLUTION; THERMAL TECHNOLOGIES; THERMO COMPRESSION BONDING;

POWER ELECTRONICS; SILVER;

ELECTRONICS INDUSTRY;

EID: 71749119351     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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