Biaxial stresses, surface roughness and microstructure in evaporated TiO 2 films with different deposition geometries

Applied Surface Science

Volumn 256, Issue 3, 2009, Pages 870-875

  Tien, Chuen Lin ^a  

^a FENG CHIA UNIVERSITY   (Taiwan)

Author keywords

Biaxial stress; Electron beam evaporation; Thin film

Indexed keywords

ANISOTROPY; ELECTRON BEAMS; EVAPORATION; GEOMETRY; MICROSTRUCTURE; PHYSICAL VAPOR DEPOSITION; RESIDUAL STRESSES; SILICON WAFERS; SUBSTRATES; SURFACE ROUGHNESS; THIN FILMS; TITANIUM DIOXIDE; TITANIUM OXIDES;

ANISOTROPIC MICROSTRUCTURES; ANISOTROPIC STRESS; BIAXIAL STRESS; DEPOSITION GEOMETRY; DIFFERENT GEOMETRY; ELECTRON BEAM EVAPORATION; IN-PLANE ANISOTROPY; TWYMAN-GREEN INTERFEROMETERS;

OXIDE FILMS;

EID: 71749118319     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2009.08.077     Document Type: Article

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