Direct-soldering 6061 aluminum alloys with ultrasonic coating

Ultrasonics Sonochemistry

Volumn 17, Issue 2, 2010, Pages 292-297

  Ding, Min ^a   Zhang, Pei lei ^a   Zhang, Zhen yu ^a   Yao, Shun ^a  

^a Shanghai Jiao Tong University   (China)

Author keywords

Direct soldering; Microstructure; Sn Pb Zn alloys; Ultrasonic coating

Indexed keywords

ALUMINA; ALUMINUM COATINGS; ALUMINUM OXIDE; BINARY ALLOYS; FRACTURE; LEAD ALLOYS; MICROSTRUCTURE; SHEAR FLOW; SHEAR STRESS; SOLDERING; SOLDERING ALLOYS; TERNARY ALLOYS; TIN ALLOYS; ZINC ALLOYS;

6061 ALUMINUM ALLOYS; COATING METHODS; CONTINUOUS REACTIONS; EUTECTIC PHASE; JOINT STRENGTH; SOLDER INTERFACES; SOLDERING TEMPERATURE; ZN ALLOYS;

ALUMINUM ALLOYS;

ALLOY; ALUMINUM; BISMUTH; LEAD; TIN;

ARTICLE; CHEMICAL REACTION; FRACTURE; MATERIAL COATING; MICROANALYSIS; PRIORITY JOURNAL; SHEAR STRESS; STRENGTH; TEMPERATURE SENSITIVITY; ULTRASOUND;

EID: 71649090093     PISSN: 13504177     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ultsonch.2009.10.007     Document Type: Article

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