Evolution of the bond interface during ultrasonic Al-Si wire wedge bonding process

Journal of Materials Processing Technology

Volumn 182, Issue 1-3, 2007, Pages 202-206

  Ji, Hongjun ^a   Li, Mingyu ^a   Wang, Chunqing ^a   Guan, Jingwei ^a   Bang, Han Sur ^b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b Chosun University   (South Korea)

Author keywords

Interface evolution; Stress; Ultrasonic bonding; Ultrasonic power

Indexed keywords

ALUMINUM COMPOUNDS; ETCHING; PARAMETER ESTIMATION; SIGNAL PROCESSING; STRESS CONCENTRATION; ULTRASONICS;

INTERFACE EVOLUTION; JOINT QUALITY; ULTRASONIC BONDING; ULTRASONIC POWER;

BONDING;

EID: 33750616216     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2006.07.033     Document Type: Article

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