New look at flux-free ultrasonic soldering

Welding Journal (Miami, Fla)

Volumn 79, Issue 9, 2000, Pages 41-45

  Faridi, Hamid R ^a   Devletian, Jack H ^a   Le, Hue P ^b  

^a Department of Electrical and Computer Engineering   (United States)

^b Picojet Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; SHEAR STRENGTH; STAINLESS STEEL; SUBSTRATES; THERMAL EFFECTS; ULTRASONIC APPLICATIONS;

FLUXLESS ULTRASONIC SOLDERING;

SOLDERING;

EID: 0034275150     PISSN: 00432296     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)

1. Antonevich, J. N. 1976. Fundamentals of ultrasonic soldering. Welding Journal 55(7): 200-s to 207-s.
2. Hunicke, R. L. 1976. Ultrasonic soldering pots for fluxless production soldering. Welding Journal 55(3): 191-194.
3. Sherry, W. August 1998. Soldering of Electronic Components. U.S. Patent No. 4763829, AT&T Bell Laboratories.
4. Garrecht and Ewald. June 1998. Device for Fluxless Soldering. U.S. Patent No. 5762257, Ersa Lottechnik GMBH.
5. Kurtz, R. 1995. Ultrasonic replace flux. Electronic Production 24(7): 17-21.
6. Biancini, J. A. 1993. Chip mounting technology. Surface Mount International 1: 17-34.
7. Chu, D. W., and Shen, D. S. 1993. Maskless flip chip solder bumping technique. Proc. of 43rd Electronic Components and Technology Conference, IEEE, New York, N.Y., pp. 610-614.
8. Ogashiwa, T., Arikawa, T., Murai, H., Inoue, A., and Masumoto. T. 1995. Reflowable Sn-Pb bump formation on Al pad by a solder bumping method. Proc. of 45th Electronic Components Technology Conference. IEEE, New York, N.Y., pp. 1203-1208.
9. Saxty, P. 1995. Ultrasonic soldering in the electronics industry. Metallurgia 62(8): 287.
10. Vianco, P. T,. Hosking, F. M., and Rejent, J. A. 1996. Ultrasonic soldering for structural and electronic applications. Welding Journal 75(11): 343-s to 355-s.
11. Hosking, F. M. 1992. Fluxless soldering as an environmentally compatible manufacturing alternative. International Journal of Environmentally Conscious Manufacturing 1(1): 53-64
12. Inaba, M., Yamakawa, K., and Nobuo, I. 1990. Solder bump formation using electroless plating and ultrasonic soldering. IEEE Transactions on Components, Hybrids, and Manufacturing Technology 13(1): 119-123.
13. Miyaka, et al. 1996. Process of Joining Metal Members. U. S. Patent No. 5511719. Nippondenso Co., Ltd., Kariya, Japan.