Understanding ultrasound-induced aluminum oxide breakage during wirebonding

Proceedings - IEEE Ultrasonics Symposium

Volumn , Issue , 2007, Pages 1381-1384

  Seppänen, Henri ^a,b   Kaskela, Antti ^a   Mustonen, Kimmo ^a   Oinonen, Markku ^a   Hæggström, Edward ^a,b  

^a UNIVERSITY OF HELSINKI   (Finland)

^b HELSINKI INSTITUTE OF PHYSICS   (Finland)

Author keywords

Bonding; Oxide breakage; Ultrasonic

Indexed keywords

ALUMINA; ALUMINUM; CONCRETE CONSTRUCTION; INTEGRATED CIRCUITS; LIGHT METALS; LIGHT REFLECTION; NONMETALS; SILICON; SLIP FORMING; WIRE;

AL OXIDE; ALUMI NUM OXIDE; BOND STRUCTURES; BONDING; BONDING PROCESSES; BONDING TECHNOLOGIES; BONDING THEORY; BREAKAGE MECHANISM; CONSTANT PRESSURE; CONTACT INTERFACES; DISPLACEMENT MEASUREMENTS; EXPERIMENTAL MEASUREMENTS; LASER DOPPLER VIBROMETER; MICRO SLIPS; OXIDE BREAKAGE; PROBE LIGHT; SEM ANALYSIS; SHAPED WIRE; STICK SLIPS; TWO-STEP MODEL; ULTRASONIC; ULTRASONIC BONDING; WIRE BONDERS; WIRE-BONDING;

ULTRASONICS;

EID: 48149083441     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ULTSYM.2007.347     Document Type: Conference Paper

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