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Volumn 168, Issue 2, 2005, Pages 303-307

Development of a flux-less soldering method by ultrasonic modulated laser

Author keywords

Flux less soldering; Modulated laser; Numerical analysis; Ultrasonic cavitation

Indexed keywords

FLUXES; HEATING; LASERS; NUMERICAL ANALYSIS; SURFACE PHENOMENA; ULTRASONIC APPLICATIONS; VACUUM; VIBRATIONS (MECHANICAL);

EID: 24044539588     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2005.02.237     Document Type: Article
Times cited : (33)

References (10)
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    • Abtew, M.1    Selvaduray, G.2
  • 2
    • 0037076832 scopus 로고    scopus 로고
    • Six case of reliability study of Pb-free solder joints in electronic packaging technology
    • K. Zeng, and K.N. Tu Six case of reliability study of Pb-free solder joints in electronic packaging technology Mater. Sci. Eng. 38R 2002 55 105
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    • Zeng, K.1    Tu, K.N.2
  • 3
    • 0035416112 scopus 로고    scopus 로고
    • Wetting properties of one-side-coated under bump metallurgy and top surface metallurgy
    • S.M. Hong, J.Y. Park, J.P. Jung, and C.S. Kang Wetting properties of one-side-coated under bump metallurgy and top surface metallurgy J. Electron. Mater. 30 8 2001 937 944
    • (2001) J. Electron. Mater. , vol.30 , Issue.8 , pp. 937-944
    • Hong, S.M.1    Park, J.Y.2    Jung, J.P.3    Kang, C.S.4
  • 4
    • 0036680628 scopus 로고    scopus 로고
    • Flux-less In-Sn bonding process at 140 °c
    • C.C. Lee, and S. Choe Flux-less In-Sn bonding process at 140 °C Mater. Sci. Eng. 333A 2002 45 50
    • (2002) Mater. Sci. Eng. , vol.333 , pp. 45-50
    • Lee, C.C.1    Choe, S.2
  • 6
    • 0037158403 scopus 로고    scopus 로고
    • High-temperature non-eutectic indium-tin joints fabricated by a flux-less process
    • R.W. Chuang, and C.C. Lee High-temperature non-eutectic indium-tin joints fabricated by a flux-less process Thin Solid Films 414 2002 175 179
    • (2002) Thin Solid Films , vol.414 , pp. 175-179
    • Chuang, R.W.1    Lee, C.C.2
  • 7
    • 0037059417 scopus 로고    scopus 로고
    • Characterization of indium and solder bump bonding
    • S. Cihangir, and S. Kwan Characterization of indium and solder bump bonding Nucl. Instrum. Meth. Phys. Res. 476A 2002 670 675
    • (2002) Nucl. Instrum. Meth. Phys. Res. , vol.476 , pp. 670-675
    • Cihangir, S.1    Kwan, S.2
  • 9
    • 33645497016 scopus 로고
    • Generation of elastic waves by transient surface heating
    • R.M. White Generation of elastic waves by transient surface heating J. Appl. Phy. 34 12 1963 12 20
    • (1963) J. Appl. Phy. , vol.34 , Issue.12 , pp. 12-20
    • White, R.M.1
  • 10
    • 0016510838 scopus 로고
    • Laser generated thermo-elastic shock wave in liquids
    • G.S. Bushanam, and F.S. Barnes Laser generated thermo-elastic shock wave in liquids J. Appl. Phy. 46 5 1975 2074 2081
    • (1975) J. Appl. Phy. , vol.46 , Issue.5 , pp. 2074-2081
    • Bushanam, G.S.1    Barnes, F.S.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.