Fabrication of wireless micro pressure sensor using the CMOS process

Sensors

Volumn 9, Issue 11, 2009, Pages 8748-8760

  Dai, Ching Liang ^a   Lu, Po Wei ^a   Wu, Chyan Chyi ^b   Chang, Chienliu ^c  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^b TAMKANG UNIVERSITY   (Taiwan)

^c CANON INC   (Japan)

Author keywords

CMOS MEMS; Oscillators; Wireless micro pressure sensor

Indexed keywords

CMOS (COMPLEMENTARY METAL OXIDE SEMICONDUCTOR); CMOS-MEMS; METAL OXIDE SEMICONDUCTOR; MICRO PRESSURE SENSORS; OUTPUT VOLTAGES; SACRIFICIAL LAYER; SUSPENDED MEMBRANES; WIRELESS TRANSMISSIONS;

ANTENNAS; CMOS INTEGRATED CIRCUITS; FIELD EFFECT TRANSISTORS; MICROSENSORS; MOS DEVICES; OSCILLATORS (ELECTRONIC);

PRESSURE SENSORS;

EID: 70849122123     PISSN: 14248220     EISSN: None     Source Type: Journal    
DOI: 10.3390/s91108748     Document Type: Article

References (13)

1. Huang, J.T.; Cheng, S.C. Study of injection molding pressure sensor with low cost and small probe. Sens. Actuat. A 2002, 101, 269-274.
2. Berns, A.; Buder, U.; Obermeier, E.; Wolter, A. AeroMEMS sensor array for high-solution wall press measurments. Sens. Actuat. A 2006, 132, 104-111.
3. Hynes, E.; O'Neill, M.; McAuliffe, D.; Berney, H.; Lane, W.A.; Kelly, G.; Hill, M. Development and characterization of a surface micromachined FET pressure sensor on a CMOS process. Sens. Actuat. A 1999, 76, 283-292.
4. Svensson, L.; Plaza, J.A.; Benitez, M.A.; Esteve, J.; Lora-Tamayo, E. Surface micromachining technology applied to the fabrication of a FET pressure sensor. J. Micromech. Microeng. 1996, 6, 80-85.
5. Lysko, J.M.; Jachowicz, R.S.; Krzycki, M.A. Semiconductor pressure sensor based on FET structure. IEEE Trans. Instrum. Meas. 1995, 44, 787-790.
6. Dai, C.L.; Tai, Y.W.; Kao, P.H. Modeling and fabrication of micro FET pressure sensor with circuits. Sensors 2007, 7, 3386-3398.
7. Baltes, H.; Brand, O. CMOS-based microsensors and packaging. Sens. Actuat. A 2001, 92, 1-9.
8. Fedder, G.K.; Howe, R.T.; Liu, T.J.K.; Quévy, E.P. Technologies for cofabricating MEMS and electronics. Proc. IEEE 2008, 96, 306-322.
9. Brand, O. Microsensor integration into systems-on-chip. Proc. IEEE 2006, 94, 1160-1175.
10. Kao, P.H.; Dai, C.L.; Hsu, C.C.; Lee, C.Y. Fabrication and characterization of a tunable in-plane resonator with low driving voltage. Sensors 2009, 9, 2062-2075.
11. Liu, M.C.; Dai, C.L.; Chan, C.H.; Wu, C.C. Manufacture of a polyaniline nanofiber ammonia sensor integrated with a readout circuit using the CMOS-MEMS technique. Sensors, 2009, 9, 869-880.
12. Dai, C.L.; Chen, Y.L. Modeling and manufacturing of micromechanical RF switch with inductors. Sensors 2007, 7, 2660-2670.
13. Senturia, S.M. Microsystem Design; Kluwer Academic: Boston, MA, USA, 2001; p. 196.