Electroless Ni-P and Ni-W-P films as a barrier for thermostimulated diffusion of gold into semiconductor

HITEN 1999 - 3rd European Conference on High Temperature Electronics

Volumn , Issue , 1999, Pages 101-105

  Stepanova, L I ^a   Bodrykh, T I ^a   Sviridov, V V ^a  

^a BELARUSIAN STATE UNIVERSITY   (Belarus)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS FILMS; DIFFUSION; DIFFUSION BARRIERS; GOLD; GOLD DEPOSITS; METALLIC FILMS; NICKEL;

CORROSION PROCESS; ELECTROLESS; ELECTROLESS NI-P; ELECTROLESS NI-P FILMS; PHOSPHORUS CONTENTS; PURE NICKELS; THEORY AND PRACTICE;

NICKEL COMPOUNDS;

EID: 77951662868     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HITEN.1999.827473     Document Type: Conference Paper

References (4)

1. Schlcsingcr M. On the Intel-diffusion of Electrolessly Deposited Nickel and Gold./Proc.Symp. Electrocryst. Hollywood. Fla. Oct. 1980. P. 221-232.
2. Sviridov V.V., Vorobyova T.N., Gaevskaya T.V., Stepanova L.I. Eleclroless metal deposition. Minsk. Universitetskoye Publ. 1987.270 P. (Russian).
3. Stepanova L.I., Bodrykh T.I., Sviridov V.V., Ivashkevich L.S. On Chemical and Phase Composition of lileetroless Ni-W-P alloy Coatings.//J. Appl. Chein. (Russian). 1996. Vol. 69. No.12. P. 1951-1956.
4. Stepanova L I., Bodrykh T.I., Sviridov V.V. Phase Transformation in Ki-W-P Alloys on Heat Treatment./Post Report on HITEH-97.