Investigation of Sn/Cu/Ni ternary alloying in lead free solder bump applications

2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Volumn , Issue , 2006, Pages

  Jin, Y G ^a   Meng, J ^a   Chen, X F ^a   Wang, T C ^a  

^a SMIC ^*  (China)

Author keywords

[No Author keywords available]

Indexed keywords

INTERMETALLICS; LEAD ALLOYS; METALLIZING; RELIABILITY ANALYSIS; SOLDERED JOINTS; SPUTTERING;

DIFFUSION RATE; SOLDER BUMPS; SOLDER REACTION; UNDER BUMP METALLIZATION (UBM) STRUCTURES;

TERNARY ALLOYS;

EID: 34948847998     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2006.359654     Document Type: Conference Paper

References (7)

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