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2009 European Microelectronics and Packaging Conference, EMPC 2009

Volumn , Issue , 2009, Pages

Direct interconnection of chemical mechanical polishing (CMP)-Cu thin films at 150°C in ambient air

(2) Shigetou, Akitsu a Suga, Tadatomo b

a NATIONAL INSTITUTE FOR MATERIALS SCIENCE (Japan)

b UNIVERSITY OF TOKYO (Japan)

Author keywords

Ambient air; Ar fast atom beam; CMP Cu; Diffusion bonding; Direct bonding; Low temperature

Indexed keywords

AMBIENT AIR; CU DIFFUSION; DIRECT BONDING; FAST ATOM BEAMS; LOW TEMPERATURES;

ATMOSPHERIC PRESSURE; ATOMS; CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; COPPER OXIDES; DIFFUSION; DIFFUSION BONDING; ELECTRIC CONDUCTIVITY; MICROELECTRONICS; NANOTECHNOLOGY; THIN FILM DEVICES; THIN FILMS; VACUUM;

COPPER;

EID: 70449814725 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (3)

References (9)

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