Bumpless interconnect of Cu electrodes in millions-pins level

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1223-1226

  Shigetou, Akitsu ^a   Itoh, Toshihiro ^b   Suga, Tadatomo ^b  

^a UNIVERSITY OF TOKYO   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CHEMICAL MECHANICAL POLISHING; COPPER; INTERCONNECTION NETWORKS; PHOTOLITHOGRAPHY; SHEAR STRENGTH;

BUMPLESS INTERCONNECT; CONTACT LOAD; SURFACE ACTIVATED BONDING (SAB) METHOD; VACUUM CONDITION;

ELECTRODES;

EID: 33845593574     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645808     Document Type: Conference Paper

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