Bumpless flip chip packages

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 173-177

  Lin, C W C ^a   Chiang, S C L ^a   Yang, T K A ^a  

^a Bridge Semiconductor Corporation   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COSTS; ELECTRONICS PACKAGING; LEAD-FREE SOLDERS; MODIFIED ATMOSPHERE PACKAGING; PACKAGING;

BOARD-LEVEL RELIABILITY; DESIGN INTEGRATIONS; ELECTRICAL CHARACTERISTIC; ELECTROCHEMICAL PLATING; ENVIRONMENTAL SPECIFICATIONS; PROCESSING TECHNOLOGIES; TECHNOLOGY DEVELOPMENT; WAFER LEVEL PACKAGE;

FLIP CHIP DEVICES;

EID: 84966593437     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188833     Document Type: Conference Paper

References (0)