Failure mechanisms of flip chip DCA assembly using eutectic solder

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 69-73

  Tan, Qing ^a   Cole, Rebecca ^a   Mistry, Addi ^a   Beddingfield, Craig ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; DELAMINATION; ELECTRONICS PACKAGING; EUTECTICS; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; PASSIVATION; RELIABILITY; SOLDERING;

DIE CRACKING; FAILURE MECHANISM; FLIP CHIP INTERCONNECTION; PACKAGING FAILURE; UNDERFILL VOID;

FLIP CHIP DEVICES;

EID: 0034483647     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)