Simulating underfill flow for microelectronics packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 294-301

  Iwamoto, N ^a   Nakagawa, M ^a   Mustoe, G G W ^a  

^a Johnson Matthey Electronics   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BINDERS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; FILLERS; MATHEMATICAL MODELS; PARTICLES (PARTICULATE MATTER);

DISCRETE ELEMENT MODELING; MICROELECTRONICS PACKAGING; MOLECULAR MODELING; UNDERFILL FLOW;

MICROELECTRONIC PROCESSING;

EID: 0032690795     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)