Flip chip underfill flow characteristics and prediction

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 790-796

  Fine, P ^a   Cobb, B ^a   Nguyen, L ^a  

^a NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT ANGLE; FILLERS; FLIP CHIP DEVICES; FLOW OF SOLIDS; INTEGRATED CIRCUIT TESTING; MATERIALS TESTING; MATHEMATICAL MODELS; PARTICLE SIZE ANALYSIS; VISCOSITY MEASUREMENT;

FLIP CHIP UNDERFILL FLOW; HELE SHAW AND WASHBURN MODELS; QUARTZ WAFER;

ELECTRONICS PACKAGING;

EID: 0032651042     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (3)