Reliability of flip chip BGA package on organic substrate

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1215-1220

  Ahn, Eun Chul ^a   Cho, Tae Je ^a   Shim, Jong Bo ^a   Moon, Ho Joong ^a   Lyu, Ju Hyun ^a   Choi, Ki Won ^a   Kang, Sa Yoon ^a   Oh, Se Yong ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; FAILURE ANALYSIS; FLIP CHIP DEVICES; RELIABILITY; SOLDERED JOINTS; TEMPERATURE;

BALL GRID ARRAY; COEFFICIENT OF THERMAL EXPANSION; EUTECTIC SOLDER BUMPS;

ELECTRONICS PACKAGING;

EID: 0034476322     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)