Physics of plasma-based ion implantation and deposition (PBIID) and high power impulse magnetron sputtering (HIPIMS): A comparison

Physica Status Solidi (A) Applications and Materials Science

Volumn 205, Issue 4, 2008, Pages 965-970

  André, Anders ^a  

^a LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DRIVING POWER SUPPLIES; EMERGING TECHNOLOGIES; GREAT-ER; HIGH VOLTAGES; HIGH-POWER; MODELLING; PEAK POWERS; PLASMA GENERATIONS; PLASMA PARAMETERS; PLASMA-BASED ION IMPLANTATIONS; PULSED PLASMAS; SECONDARY ELECTRON EMISSIONS; SECONDARY ELECTRONS; SPUTTERED MATERIALS; STRONG MAGNETIC FIELDS; SURFACE ATOMS;

ATOMS; DC GENERATORS; ELECTRON EMISSION; ION BOMBARDMENT; ION IMPLANTATION; IONS; MAGNETIC FIELDS; MAGNETRON SPUTTERING; MAGNETRONS; PLASMA DIAGNOSTICS; PLASMA SHEATHS; PLASMAS; SECONDARY EMISSION;

PLASMA DEPOSITION;

EID: 54849407836     PISSN: 18626300     EISSN: 18626319     Source Type: Journal    
DOI: 10.1002/pssa.200778311     Document Type: Article

References (31)

1. J. Priestley, The History and Present State of Electricity, 3rd ed. (London, 1775).
2. W. R. Grove, Philos. Mag., 498 (December 1852).
3. R. J. Adler and S. T. Picraux, Nucl. Instrum. Meth. Phys. Res. B 6(1/2), 123 (1985).
4. J. R. Conrad, J. L. Radtke, R. A. Dodd, F. J. Worzala, and N. C. Tran, J. Appl. Phys. 62(11), 4591 (1987).
5. A. Anders (Ed.), Handbook of Plasma Immersion Ion Implantation and Deposition (John Wiley & Sons, New York, 2000).
6. A. T. Forrester, Large Ion Beams (Wiley, New York, 1988).
7. J. R. Conrad, J. Appl. Phys. 62(3), 777 (1987).
8. V. Kouznetsov, K. Macak, J. M. Schneider, U. Helmersson, and I. Petrov, Surf. Coat. Technol. 122, 290 (1999).
9. F. F. Chen, Plasma Physics and Controlled Fusion (Plenum Press, New York, 1984).
10. N. Hosokawa, T. Tsukada, and H. Kitahara, Proc. 8th Int. Vacuum Congress, Le Vide, Cannes, France, 1980, p. 11.
11. J. A. Hopwood (Ed.), Ionized Physical Vapor Deposition (Academic Press, San Diego, CA, 2000).
12. A. Anders and G. Y. Yushkov, Surf. Coat. Technol. 136, 111 (2001).
13. A. Bogaerts and R. Gijbels, Plasma Sources Sci. Technol. 11, 27 (2002).
14. K. Nakamura and M. A. H. Sugai, Electron. Eng. (Japan) 151(3), 1 (2005).
15. D. J. Rej, B. P. Wood, R. J. Faehl, and H. H. Fleischmann, J. Vac. Sci. Technol. B 12(2), 861 (1994).
16. I. H. Tan, M. Ueda, R. S. Dallaqua, R. d. M. Oliveira, and J. O. Rossi, J. Appl. Phys. 100(3), 033303 (2006).
17. A. Anders, J. Andersson, and A. Ehiasarian, J. Appl. Phys.102, 113303 (2007); Erratum J. Appl. Phys. 103, 039901 (2008).
18. M. Nastasi, X.-M. He, K. C. Walter, M. Hakovirta, and M. Trkula, Surf. Coat. Technol. 136, 162 (2001).
19. W. J. Boardman, A. W. Tudhope, and R. D. Mercado, Patent EP 1619265 Al (2006).
20. T. Casserly, K. Boinapally, M. Oppus, D. Upadhyaya, B. Boardman, and A. Tudhope, Proc. Annual Techn. Meeting of the Society of Vacuum Coaters (SVC), Louisville, KY, 2007, pp. 64-67.
21. J. T. s Scheuer, M. Shamim, and J. R. Conrad, J. Appl. Phys. 67(3), 1241 (1990).
22. M. A. Lieberman, J. Appl. Phys. 66(7), 2926 (1989).
23. T. Ikehata, K. Shioya, T. Araki, N. Y. Sato, H. Mase, and K. Yukimura, Nucl. Instrum. Methods Phys. Res. B 206, 772 (2003).
24. Y. Miyagawa, H. Nakadate, M. Tanaka, M. Ikeyama, and S. Miyagawa, Surf. Coat. Technol. 186(1/2), 2 (2004).
25. L. Oksuz and N. Hershkowitz, Plasma Sources Sci. Technol. 14(1), 201 (2005).
26. J. T. Scheuer and G. A. Emmert, Phys. Fluids 31(6), 1748 (1988).
27. A. E. Wendt and M. A. Lieberman, J. Vac. Sci. Technol. A 8(2), 902 (1990).
28. T. E. Sheridan, M. J. Goeckner, and J. Goree, J. Vac. Sci. Technol. A 8(1), 30 (1990).
29. J. W. Bradley and G. Lister, Plasma Sources Sci. Technol. 6(4), 524 (1997).
30. D. J. Christie, J. Vac. Sci. Technol. A 23(2), 330 (2005).
31. S. Berg, H.-O. Blom, M. Moradi, and C. Nender, J. Vac. Sci. Technol. A 7(3), 1225 (1989).