Time and temperature dependence of early stage stress-induced-voiding in Cu/low-k interconnects

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2009, Pages 457-463

  Croes, K ^a   Wilson, C J ^a,b   Lofrano, M ^a   Travaly, Y ^a   De Roest, D ^c   Tokei, Zs ^a   Beyer, G P ^a  

^a IMEC   (Belgium)

^b NEWCASTLE UNIVERSITY   (United Kingdom)

^c ASM BELGIUM   (Belgium)

Author keywords

BEOL; Copper; FEM; Stress induced voiding; Voiding below VIA; Voiding in VIA

Indexed keywords

BEOL; FEM; STRESS-INDUCED-VOIDING; VOIDING BELOW VIA; VOIDING IN VIA;

COPPER; DEGRADATION; FINITE ELEMENT METHOD; GRAIN BOUNDARIES; PHASE INTERFACES; PLATES (STRUCTURAL COMPONENTS); STRUCTURAL METALS; TEMPERATURE DISTRIBUTION;

ACTIVATION ENERGY;

EID: 70449102643     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IRPS.2009.5173297     Document Type: Conference Paper

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