Shearing strength and materials interaction during reflow of Al/Cu/electroless nickel/solder bump

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 607-612

  Lin, Kwang Lung ^a   Liu, Yi Cheng ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COPPER; DIFFUSION IN SOLIDS; ELECTRODES; ELECTRONICS PACKAGING; ELECTROPLATING; FRACTURE; INTERMETALLICS; MULTILAYERS; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH;

ELECTROLESS NICKEL; INTERDIFFUSION BEHAVIOR; REFLOW PROCESS; UNDER BUMP METALLURGY;

FLIP CHIP DEVICES;

EID: 0032651048     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)