Characterization of MEMS-on-tube assembly: Reflow bonding of borosilicate glass (Duran®) tubes to silicon substrates

Journal of Micromechanics and Microengineering

Volumn 19, Issue 8, 2009, Pages

  Moulkoc B ^a   Jansen, H V ^a   Berenschot, J W ^a   Ter Brake, H J M ^a   Knowles, K M ^b   Elwenspoek, M C ^a,c  

^a UNIVERSITY OF TWENTE   (Netherlands)

^b UNIVERSITY OF CAMBRIDGE   (United Kingdom)

^c UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CRISTOBALITES; GAS DIFFUSION; HERMETICITY; HETEROGENEOUS NUCLEATION AND GROWTH; JOINING TECHNOLOGY; MICRO FLUIDIC APPLICATIONS; MICRO-FLUIDIC DEVICES; PRESSURE TESTS; REFLOW BONDING; SILICON SUBSTRATES; SURFACE CRYSTALLIZATION; WAFER LEVEL;

CRYSTALLIZATION; GLASS BONDING; HEAT TREATMENT; JOINING; LEAKAGE (FLUID); METALLIC GLASS; MICROCRACKING; MICROFLUIDICS; SEMICONDUCTING SILICON COMPOUNDS; SILICATE MINERALS; SILICON WAFERS; TUBES (COMPONENTS); WAFER BONDING;

BOROSILICATE GLASS;

EID: 70350666523     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/8/085027     Document Type: Article

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