Fluidic packaging of microengine and microrocket devices for high-pressure and high-temperature operation

Journal of Microelectromechanical Systems

Volumn 13, Issue 1, 2004, Pages 31-40

  Peles, Yoav ^a   Srikar, V T ^b   Harrison, Todd S ^b   Protz, Christopher ^b   Mracek, Anna ^b   Spearing, S Mark ^b  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b USA   (United States)

Author keywords

Kovar silicon seal; Microengine; Microfluidic packaging; Power MEMS

Indexed keywords

ELECTRONICS PACKAGING; HERMETIC SEALS; HIGH TEMPERATURE OPERATIONS; MICROELECTRONIC PROCESSING; PRESSURE; SEMICONDUCTING SILICON; WETTING;

FLUIDIC PACKAGING; MICROENGINE; MICROROCKET;

MICROELECTROMECHANICAL DEVICES;

EID: 1542604565     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2003.823223     Document Type: Article

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