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Volumn 77, Issue 1, 1999, Pages 57-65

Novel interconnection technologies for integrated microfluidic systems

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; FLUIDIC DEVICES; PRESSURE TRANSDUCERS; REACTIVE ION ETCHING; SENSORS; SILICON;

EID: 0033363098     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(99)00185-5     Document Type: Article
Times cited : (180)

References (13)
  • 4
    • 0042495215 scopus 로고
    • Components for microfluidic handling modules
    • in: A. van den Berg, P. Bergveld (Eds.), Twente, Netherlands, November 21-22, 1994, Kluwer Academic Publishers, Dordrecht
    • W.K. Schomburg, B. Büstgens, J. Fahrenberg, D. Maas, Components for microfluidic handling modules, in: A. van den Berg, P. Bergveld (Eds.), Micro Total Analysis Systems, Twente, Netherlands, November 21-22, 1994, Kluwer Academic Publishers, Dordrecht, 1995, pp. 255-258.
    • (1995) Micro Total Analysis Systems , pp. 255-258
    • Schomburg, W.K.1    Büstgens, B.2    Fahrenberg, J.3    Maas, D.4
  • 13
    • 85031580724 scopus 로고    scopus 로고
    • CFD-GEOM, CFD-ACE, CFD-VIEW Manuals, CFD Research Corporation, Huntsville
    • CFD-GEOM, CFD-ACE, CFD-VIEW Manuals, CFD Research Corporation, Huntsville, 1997.
    • (1997)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.