Bond strength tests between silicon wafers and duran tubes (fusion bonded fluidic interconnects)

Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05

Volumn 1, Issue , 2005, Pages 936-939

  Fazal, Imran ^a   Berenschot, Erwin ^a   DeBoer, Rik ^a   Jansen, Henri ^a   Elwenspoek, Miko ^a  

^a UNIVERSITY OF TWENTE   (Netherlands)

Author keywords

Bond strength; Duran tubes; Fluidic interconnects; Fusion bonding; MEMS

Indexed keywords

DURAN TUBES; FLUIDIC INTERCONNECTS; FUSION BONDING; MEMS;

COATING TECHNIQUES; GLASS; HIGH PRESSURE EFFECTS; MICROELECTROMECHANICAL DEVICES; SILICON NITRIDE; SILICON WAFERS; TUBES (COMPONENTS);

BOND STRENGTH (CHEMICAL);

EID: 27544506515     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2005.1496572     Document Type: Conference Paper

References (11)

1. N. H. Bings, C. Wang, C. D. Skinner, C. L. Coyler, P. Thibbault, D. J. Harrison, "Microfluidic devices connected to fused silica capillaries with minimal dead volume" Anal. Chemistry 71 (1999), p. 3292-3296.
2. N. J. Moourlas, D. Jaeggi, A. l. Flannery, "Novel interconnections and channel technologies for microfluidics" S & A 77, no. 1 (1999), p. 57-65.
3. T. S. Harrison, "Packaging of the MIT microengine" S. M., Mass Inst. Technology, Cambridge MA 2000.
4. T. S. Harrison, A. P. London and S. M. Spearing, "High temperature, high pressure fluid connections for power Microsystems" in Mater. Res. Soc. Proc., vol. 654, 2001, paper EE6.5.
5. S. E. Shoaf, A. D. Feinerman, "Aligned Au-Si eutectic bonding of silicon structures", J. Vac. Sci. Tech. A 12(1) (1994), p. 19-22.
6. T. J. You, S. Lee, W. Fang, Y. C. Tai, "Micromachined rubber O-ring microfluidic couplers" Proceedings MEMS Miyazaki, Japan (2000), p. 624-627.
7. A. Puntambekar, C. H. Ahn, " Self aligning microfluidic interconnects with low dead volume" Proceedings of μ Tas, Enschede, The Netherlands (2000), p. 323-326
8. Marko Blom "On chip separation and sensing systems for hydrodynamic chromatography" University of Twente, Enschede, The Netherlands, 2000.
9. Yoav Peles, V. T. Sarkar, Todd S. Harrison, Christorpher Protz, Anna Mracek and S. Mark Spearing " Fluid packaging of microengine and microrocket Devices for high pressure and high tempratuer operation" J. Micromechanical Systems, Vol. 13, No. 1, February 2004.
10. Christine Harendt, Wolfgang Appel, Heinz-Gerd Graf, Bernd Hoefflinger and Elisabeth Penteker "Wafer fusion bonding and its application to silicon on insulator fabrication" J. Micromech. Microengg. 1(1991) 145-151.
11. M. C. Elwenspoek, H. Jansen "Silicon Micromachining" Cambridge University Press, 1998.