Fusion-bonded fluidic interconnects

Journal of Micromechanics and Microengineering

Volumn 18, Issue 5, 2008, Pages

  Fazal, I ^a   Elwenspoek, M C ^a  

^a UNIVERSITY OF TWENTE   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; FLUIDIC DEVICES; HIGH PRESSURE EFFECTS; SILICON NITRIDE; SILICON WAFERS;

FLUIDIC INTERCONNECTS; FUSION BONDING;

GLASS;

EID: 42549168452     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/5/055011     Document Type: Article

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