RF sputtering: A viable tool for MEMS fabrication

Sadhana - Academy Proceedings in Engineering Sciences

Volumn 34, Issue 4, 2009, Pages 543-556

  Chandra, Sudhir ^a   Bhatt, Vivekanand ^a   Singh, Ravindra ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY DELHI   (India)

Author keywords

Dielectric films; MEMS; Micromachining; Piezoelectric films; RF sputtering

Indexed keywords

BULK- MICROMACHINING; C-AXIS ORIENTED FILM; CONDUCTING MATERIALS; CURVATURE MEASUREMENT; DEPOSITION OF FILMS; DEPOSITION PARAMETERS; EXTERNAL HEATING; FABRICATION SEQUENCE; LOW STRESS; LOW TEMPERATURES; MEMS FABRICATION; MEMS-STRUCTURE; MICROELECTROMECHANICAL SYSTEMS; PHOSPHOSILICATE GLASS; PIEZOELECTRIC FILMS; PLASMA ENHANCED CHEMICAL VAPOUR DEPOSITION; POST-CMOS; POTENTIAL TECHNIQUES; PROTOTYPING; RF SPUTTERING; RF-POWER; SELF-HEATING; SPUTTERING PRESSURES; SPUTTERING TECHNIQUES; TEMPERATURE-SENSITIVE; ZNO; ZNO FILMS;

ARGON; CHROMIUM; COMPOSITE MICROMECHANICS; DIELECTRIC DEVICES; DIELECTRIC FILMS; FABRICATION; HEATING; MEMS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; PIEZOELECTRIC TRANSDUCERS; PIEZOELECTRICITY; PLASMA DEPOSITION; PLATINUM; POLYSILICON; PRESSURE EFFECTS; SEMICONDUCTING ZINC COMPOUNDS; SILICON COMPOUNDS; SILICON OXIDES; SUBSTRATES; ZINC OXIDE;

PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

EID: 70350523369     PISSN: 02562499     EISSN: 09737677     Source Type: Journal    
DOI: 10.1007/s12046-009-0032-y     Document Type: Article

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