Effect of high magnetic field on the morphology of (Cu, Ni)6Sn5 at Sn0.3Ni/Cu interface

Materials Letters

Volumn 63, Issue 17, 2009, Pages 1478-1480

  Cheng, Cong qian ^a   Zhao, Jie ^a   Xu, Yang ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

(Cu, Ni)6Sn5; High magnetic field; Intermetallic compound; Microstructure; Ni content

Indexed keywords

(CU, NI)6SN5; APPLIED MAGNETIC FIELDS; HIGH MAGNETIC FIELD; INTERMETALLIC COMPOUND; INTERMETALLIC COMPOUND LAYERS; LIQUID CONVECTIONS; MORPHOLOGY EVOLUTIONS; NI CONTENT; OUTER LAYERS;

CRYSTAL ORIENTATION; MAGNETIC MATERIALS; MAGNETISM; MICROSTRUCTURE; NICKEL; PHASE DIAGRAMS; PHASE INTERFACES; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; TIN;

MAGNETIC FIELD EFFECTS;

EID: 67349111029     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2009.03.048     Document Type: Article

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