Investigation of pattern coating on mould roller in roller-reversal imprint process

Microelectronic Engineering

Volumn 86, Issue 12, 2009, Pages 2412-2416

  Jiang, Weitao ^a   Liu, Hongzhong ^a   Ding, Yucheng ^a   Shi, Yongsheng ^a   Yin, Lei ^a   Lu, Bingheng ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

Full filling; Partial filling; Pattern coating; Roller reversal imprint (RRI) process

Indexed keywords

COATING MODEL; COATING PROCESS; CRITICAL CHALLENGES; CRITICAL VALUE; ELECTRONICS MATERIALS; FILLING IN; FILLING MODEL; FLEXIBLE SUBSTRATE; FULL FILLING; MICROPATTERNS; PARTIAL FILLING; PATTERN COATING; ROLLER-REVERSAL IMPRINT (RRI) PROCESS; SEMICONDUCTOR POLYMERS; SIMULATION RESULT; SURFACE ENERGIES;

ASPECT RATIO; COATINGS; CONTACT ANGLE; ELECTRONIC EQUIPMENT; INK; MICROCAVITIES; MOLDS; PRESSURE DROP; ROLLERS (MACHINE COMPONENTS); SIMULATORS; SUBSTRATES; SURFACE CHEMISTRY; SURFACE TENSION;

FILLING;

EID: 70349778669     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.05.003     Document Type: Article

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