Microtransfer molding of hydrophobic dendrimer

Microelectronic Engineering

Volumn 83, Issue 4-9 SPEC. ISS., 2006, Pages 1513-1516

  Thibault, C ^a   Severac, C ^a   Trevisiol E ^b   Vieu, C ^a  

^a LAAS CNRS   (France)

^b UMR792 INGÉNIERIE DES SYSTÈMES BIOLOGIQUES ET DES PROCÉDÉS   (France)

Author keywords

Dendrimer; Microcontact printing; Microtransfer molding; Soft lithography

Indexed keywords

ASPECT RATIO; CONCENTRATION (PROCESS); HYDROPHOBICITY; LITHOGRAPHY; NANOSTRUCTURED MATERIALS; PRINTING; TRANSFER MOLDING;

MICROCONTACT PRINTING; MICROTRANSFER MOLDING; SOFT-LITHOGRAPHY; SOFT-LITHOGRAPHY PROCESS;

DENDRIMERS;

EID: 33646053840     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.01.213     Document Type: Article

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