Development of novel, flexible, electrically conductive adhesives for next-generation microelectronics interconnect applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1272-1276

  Li, Yi ^a   Yim, M J ^a   Moon, K ^a   Zhang, R W ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; APPLICATIONS; BOND STRENGTH (MATERIALS); COMPUTER NETWORKS; DIFFERENTIAL SCANNING CALORIMETRY; ELASTIC MODULI; ELECTRIC CONDUCTIVITY; ELECTRIC PROPERTIES; FLAT PANEL DISPLAYS; GLASS; INORGANIC COATINGS; LASER INTERFEROMETRY; MECHANICAL PROPERTIES; MICROELECTRONICS; SUPERCONDUCTING TRANSITION TEMPERATURE;

ADHESION STRENGTHS; ELECTRONIC COMPONENTS; INTERCONNECT APPLICATIONS;

GLASS TRANSITION;

EID: 51349093948     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550138     Document Type: Conference Paper

References (19)

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12. Y. Li, K. Moon, and C. P. Wong, "Monolayer Protected Silver Nano-particle Based Anisotropic Conductive Adhesives (ACA): Electrical and Thermal Properties Enhancement", J. Electron. Mater., 34-12 (2005) 1573-1578.
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19. Y. Li, M. J. Yim, K. Moon, and C. P. Wong, "Introduction of Self Assembled Monolayer in Electrically Conductive Adhesive Joints to Enhance Electrical Current Carrying Capability and Electrical Stability", U.S. Patent pending, GTRC Invention No. 3975 (2006).