Recent advances in composite substrate materials for high-density and high reliability packaging applications

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1364-1372

  Kumbhat, Nitesh ^a   Raj, P Markondeya ^a   Pucha, Raghuram V ^a   Atmur, Steve ^b   Doraiswamy, Ravi ^a   Sundaram, Venky ^a   Bhattacharya, Swapan ^a   Sitaraman, Suresh K ^a   Tummala, Rao R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Starfire Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SUBSTRATE MATERIALS; THERMAL-SHOCK RELIABILITY TESTS; WIRING DENSITY;

COMPUTER SIMULATION; ELECTRIC WIRING; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MACHINABILITY; PRINTED CIRCUIT BOARDS; RELIABILITY; SILICON CARBIDE; SOLDERED JOINTS; SUBSTRATES;

COMPOSITE MATERIALS;

EID: 24644483345     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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