Micromachined LCP connectors for packaging MEMS devices in biological environments

Journal of Microelectronics and Electronic Packaging

Volumn 4, Issue 1, 2007, Pages 17-22

  Dean, Robert ^a   Weller, Jenny ^b   Bozack, Mike ^b   Farrell, Brian ^b   Jauniskis, Linas ^b   Ting, Joseph ^b   Edell, David ^b   Hetke, Jamille ^b  

^a AUBURN UNIVERSITY   (United States)

^b NONE

Author keywords

Biomedical; LCP; MEMS; Micromachined; Packaging

Indexed keywords

BIOCOMPATIBILITY; BIOMEDICAL ENGINEERING; ELECTRIC CONNECTORS; ELECTRONICS PACKAGING; LIQUID CRYSTAL POLYMERS; MICROMACHINING;

BIOCOMPATIBLE CONNECTORS; BIOLOGICAL ENVIRONMENTS; ELECTRICAL TRACES;

MEMS;

EID: 34250014641     PISSN: 15514897     EISSN: None     Source Type: Journal    
DOI: 10.4071/1551-4897-4.1.17     Document Type: Article

References (24)

1. J. F. Hetke and D. J. Anderson, "Silicon microelectrodes for extracellular recording," Handbook of Neuroprosthetic Methods, W. E. Finn and P. O. LoPresti, Eds. Boca Raton, FL: CRC Press, 2002.
2. K. D. Wise, D. J. Anderson, J. F. Hetke, D. R. Kipke, and K. Najafi, "Wireless implantable microsystems: High-density electronic interfaces to the nervous system," Proceedings of the IEEE, vol. 92, pp. 76-97, 2004.
3. E.M. Maynard, C.T. Nordhausen and R.A. Normann, "The Utah intracortical electrode array: A recording structure for potential brain-computer interfaces," Electroencephalogr. Clin. Neurophysiol. vol. 102, pp. 228-239, 1997.
4. P. Norlin, M. Kindlundh, A. Mouroux, K. Yoshida and U.G. Hofmann, "A 32-site neural recording probe fabricated by DRIE of SOI substrates," J. Micromech. Microeng., vol. 12, pp. 414-419, 2002.
5. T.H. Yoon, E.J. Hwang, D.Y. Shin, S.I. Park, S.J. Oh, S.C. Jung, H.C. Shin and S.J. Kim, "A micromachined silicon depth probe for multichannel neural recording," IEEE Trans. Biomed. Eng., vol. 47, pp. 1082-1087, Aug. 2000.
6. K.C. Cheung, K. Djupsund, Y. Dan and L.P. Lee, "Implantable multichannel electrode array based on SOI technology," J. Microelectromech. Systems," vol. 12, pp. 179-184, Apr. 2003.
7. K.A. Moxon, N.M. Kalkhoran, M. Markert, M.A. Sambito, J.L. McKenzie and J.T. Webster, "Nanostructured surface modification of ceramic-based microelectrodes to enhance biocompatibility for a direct brain-machine interface," IEEE Trans. Biomed. Eng., vol. 51, pp. 881-889, June 2004.
8. G. Buzsaki, "Large scale recording of neuronal ensembles," Nature Neuroscience, vol. 7, pp. 446-451, 2004.
9. B. J. Mickey and J. C. Middlebrooks, "Representation of auditory space by cortical neurons in awake cats," J. Neurosci., vol. 23, pp. 8649-8663, 2003.
10. J. Martindale, J. Mayhew, J. Berwick, M. Jones, C. Martin, D. Johnston, P. Redgrave, and Y. Zheng, "The hemodynamic impulse response to a single neural event," J. Cereb. Blood Flow Metab., vol. 23, pp. 546-555, 2003.
11. M. Stopfer, V. Jayaraman, and G. Laurent, "Intensity versus identity coding in an olfactory system," Neuron, vol. 39, pp. 991-1004, 2003.
12. R. J. Vetter, J. C. Williams, J. F. Hetke, E. A. Nunamaker, and D. R. Kipke, "Chronic neural recording using silicon-substrate microelectrode arrays implanted in cerebral cortex.," IEEE Transactions On Biomedical Engineering, vol. 51, pp. 896-904, 2004.
13. J. F. Hetke, J. L. Lund, K. Najafi, K. D. Wise, and D. J. Anderson, "Silicon ribbon cables for chronically implantable microelectrode arrays," IEEE Trans Biomed Eng, vol. 41, pp. 314-21, 1994.
14. R. W. Lusignea, "Liquid Crystal Polymers: New Barrier Materials for Packaging", Packaging Technology, October 1997.
15. B. Farrell, P. Jaynes and D. Kubiak, and R. Dean, 'Microfabrication Techniques for Liquid Crystal Polymer Substrates', IMAPS Advanced Technology Workshop on Packaging of MEMS & Related Micro Integrated Nano Systems, Baltimore, Sept 6-8, 2002.
16. th IEEE Inter. Conf. on Micro Electro Mechanical Systems, Interlaken, Switzerland, Proceedings pp. 126-130, January 21-25, 2001.
17. X. Wang, J. Engel and C. Liu, "Liquid Crystal Polymer (LCP) for MEMS: Processes and Applications," J. Micromechanics and Microengineering, vol 13, pp.628-633, 2003.
18. R. Yang and G. Mao, "Liquid crystal polymer for flexible circuits," U.S. patent number 6,403,211, issued June 11, 2002.
19. R. Dean, N. Schutz and L. Thomas, "Microsystems and Packaging Applications," Liquid Crystal Polymer Material Processing & Applications Symposium, Huntsville, AL, Oct 29, 2002.
20. D. Fries, G. Steimle, S. Natarajan, S. Ivanov, H. Broadbent and T. Weller, "Maskless Lithographic PCB/Laminate MEMS for a Salinity Sensing System," IMAPS Advanced Technology Workshop on Packaging of MEMS & Related Micro Integrated Nano Systems, Denver, CO, Sept 6-8, 2002.
21. Microconnex High Density Interconnect Solutions, 34935 SE Douglas Street, Suite 200, Snoqualmie, WA 98065, www.microconnex.com.
22. D. Satas, Plastics Finishing and Decoration, NY, Van Nostrand Reinhard Company, NY, 1986, pp. 93-97.
23. A. Grill, Cold Plasma in Materials Fabrication, NY, IEEE Press, NY, 1994, pp. 151-160.
24. C. E. Wicks and F. E. Block, "Thermodynamic Properties of 65 Elements - Their Oxides, Halides, Carbides, and Nitrides," Bulletin 605, Bureau of Mines, U.S. Government Printing Office, Washington, D.C., 1963.