Flip chip Package-in-Package (fcPiP): A new 3D packaging solution for mobile platforms

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1425-1430

  Pendse, Raj ^a   Choi, B S ^a   Kim, Baker ^a   Kim, K M ^a   Kim, Y C ^a   Lee, Kenny ^a   Park, Susan ^a   Yang, D W ^a   Zhao, Lily ^b   Gregorich, Tom ^b   Holmes, Pat ^b   Reyes, Ed ^b  

^a STATS ChipPAC Ltd   (United States)

^b QUALCOMM INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BASEBAND DEVICES; DEVICE ARCHITECTURE; FLIP CHIP PACKAGE-IN-PACKAGE (FCPIP); MOBILE PRODUCTS; WIRE BONDING;

COMPUTER ARCHITECTURE; FLIP CHIP DEVICES; MOBILE DEVICES; RELIABILITY ANALYSIS; SUBSTRATES; WAFER BONDING;

CHIP SCALE PACKAGES;

EID: 35348829738     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373982     Document Type: Conference Paper

References (5)

1. Sota, L., "Stacked System Integration Package" Semi Technology Symposium, San Franciso, CA, July 1999.
2. Yano, Y et al "3D Very Thin Stacked Packaging Technology for SIP," Proc 52nd Electronic Components and Technology Conf, San Diego CA, May. 2002, pp. 1329-1334.
3. Kamezos, M et al "3D Pacakging Promises Performance, Reliability Gains with Small Footprints," Chip Scale Review, Jan-Feb 2005, pp. 58-63.
4. th Electronic Components and Technology Conf, San Diego, CA, May. 2006, pp. 1386-1391.
5. th Electronic Components and Technology Conference, May 1990, pp. 322-326.