SCOPUS 정보 검색 플랫폼

Volumn 48, Issue 6 PART 2, 2009, Pages

Thermal imprint lithography onto filler incorporated composite resin

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE RESINS; FILLER CONTENTS; FILLER INTERACTION; PATTERN TRANSFERS; SQUEEZING FLOW; THERMAL IMPRINT; THERMOSET RESIN;

FILLERS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; RESINS; SILICON COMPOUNDS; THERMOSETS;

NANOIMPRINT LITHOGRAPHY;

EID: 70249123133 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.48.06FH16 Document Type: Article

Times cited : (2)

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