Reliability prediction for TFBGA assemblies

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 2, 2006, Pages 379-384

  Radivojevic, Zoran ^a   Abdul Quadir, Yasir ^a   Myllykoski, Pirkka ^a   Rantala, Jukka ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

Power cycling (PC); Reliability; Solder joint

Indexed keywords

FINITE ELEMENT METHOD; FORECASTING; MATHEMATICAL MODELS; OPTICAL INTERCONNECTS; POLYSILICON; RELIABILITY; SEMICONDUCTOR DEVICE MANUFACTURE; SOLDERED JOINTS; STRESSES; THERMAL EXPANSION;

INTEGRATION PACKAGING TECHNOLOGIES; POWER CYCLING; THERMOMECHANICAL STRESS; THIN FINE PITCH GALL GRID ARRAY (TFBGA) PACKAGES;

ELECTRONICS PACKAGING;

EID: 33744782871     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.875889     Document Type: Article

References (5)

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3. L. F. Coffin Jr., "A study of the effects of cyclic thermal stress on a ductile metal," Trans. ASME 76, p. 931, 1954.
4. K. Norris and A. Landzberg. (1969, May) Reliability of controlled collapse interconnections. IBM J. Res. Dev., pp. 266-271
5. Nokia Research Center, "FEM Thermomechanical Reliability Simulations - Nokia Standard Procedure," Tech. Rep., Dallas, TX, Apr. 2000.