Correlation between power cycling and thermal cycling fatigue reliabilities of chip-scale packages

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 29, Issue , 2004, Pages 26-30

  Wang, Tong Hong ^a   Lee, Chang Chi ^a   Lai, Yi Shao ^a   Huang, Chun En ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; HEAT LOSSES; INTERFEROMETRY; PERSONAL DIGITAL ASSISTANTS; SOLDERED JOINTS; THERMAL CYCLING; VISCOPLASTICITY; WIRELESS TELECOMMUNICATION SYSTEMS;

FATIGUE RESISTANCE; POWER CYCLING; THERMOMECHANICAL DEFORMATIONS; TRANSIENT THERMAL DISSIPATION;

CHIP SCALE PACKAGES;

EID: 4644372568     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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