-
1
-
-
33645236010
-
-
0026-2714,. 10.1016/j.microrel.2005.10.013
-
R. Singh, Microelectron. Reliab. 0026-2714 46, 713 (2006). 10.1016/j.microrel.2005.10.013
-
(2006)
Microelectron. Reliab.
, vol.46
, pp. 713
-
-
Singh, R.1
-
2
-
-
32844463750
-
-
0883-7694.
-
S. Dhar, S. R. Wang, J. R. Williams, S. T. Pantelides, and L. C. Feldman, MRS Bull. 0883-7694 30, 288 (2005).
-
(2005)
MRS Bull.
, vol.30
, pp. 288
-
-
Dhar, S.1
Wang, S.R.2
Williams, J.R.3
Pantelides, S.T.4
Feldman, L.C.5
-
3
-
-
47549117546
-
-
0003-6951,. 10.1063/1.2949081
-
T. Zheleva, A. Lelis, G. Duscher, F. Liu, I. Levin, and M. Das, Appl. Phys. Lett. 0003-6951 93, 022108 (2008). 10.1063/1.2949081
-
(2008)
Appl. Phys. Lett.
, vol.93
, pp. 022108
-
-
Zheleva, T.1
Lelis, A.2
Duscher, G.3
Liu, F.4
Levin, I.5
Das, M.6
-
4
-
-
0141828134
-
-
0003-6951,. 10.1063/1.1609053
-
K. Y. Gao, Th. Seyller, L. Ley, F. Ciobanu, G. Pensl, A. Tadich, J. D. Riley, and R. G. C. Leckey, Appl. Phys. Lett. 0003-6951 83, 1830 (2003). 10.1063/1.1609053
-
(2003)
Appl. Phys. Lett.
, vol.83
, pp. 1830
-
-
Gao, K.Y.1
Seyller, Th.2
Ley, L.3
Ciobanu, F.4
Pensl, G.5
Tadich, A.6
Riley, J.D.7
Leckey, R.G.C.8
-
5
-
-
34547666790
-
3/4H-SiC structures
-
DOI 10.1063/1.2757608
-
M. Avice, S. Diplas, A. Thogersen, J. S. Christensen, U. Grossner, B. G. Svensson, O. Nilsen, H. Fjellvag, and J. F. Watts, Appl. Phys. Lett. 0003-6951 91, 052907 (2007). 10.1063/1.2757608 (Pubitemid 47210829)
-
(2007)
Applied Physics Letters
, vol.91
, Issue.5
, pp. 052907
-
-
Avice, M.1
Diplas, S.2
Thogersen, A.3
Christensen, J.S.4
Grossner, U.5
Svensson, B.G.6
Nilsen, O.7
Fjellvag, H.8
Watts, J.F.9
-
6
-
-
49249139436
-
-
0018-9383,. 10.1109/TED.2008.926647
-
T. Hatayama, S. Hino, N. Miura, T. Oomori, and E. Tokumitsu, IEEE Trans. Electron Devices 0018-9383 55, 2041 (2008). 10.1109/TED.2008.926647
-
(2008)
IEEE Trans. Electron Devices
, vol.55
, pp. 2041
-
-
Hatayama, T.1
Hino, S.2
Miura, N.3
Oomori, T.4
Tokumitsu, E.5
-
7
-
-
0037415948
-
-
0040-6090,. 10.1016/S0040-6090(02)01262-2
-
S. Jakschik, U. Schroeder, T. Hecht, M. Gutsche, H. Seidl, and J. W. Barthe, Thin Solid Films 0040-6090 425, 216 (2003). 10.1016/S0040-6090(02)01262- 2
-
(2003)
Thin Solid Films
, vol.425
, pp. 216
-
-
Jakschik, S.1
Schroeder, U.2
Hecht, T.3
Gutsche, M.4
Seidl, H.5
Barthe, J.W.6
-
8
-
-
33751034917
-
-
0168-583X,. 10.1016/0168-583X(92)96133-J
-
G. Battistig, G. Amsel, E. d'Artemare, and I. Vickridge, Nucl. Instrum. Methods Phys. Res. B 0168-583X 66, 1 (1992). 10.1016/0168-583X(92)96133-J
-
(1992)
Nucl. Instrum. Methods Phys. Res. B
, vol.66
, pp. 1
-
-
Battistig, G.1
Amsel, G.2
D'Artemare, E.3
Vickridge, I.4
-
9
-
-
0000081968
-
-
0003-6951,. 10.1063/1.125519
-
T. M. Klein, D. Niu, W. S. Epling, W. Li, D. M. Maher, C. C. Hobbs, R. I. Hegde, I. J. R. Baumvol, and G. N. Parsons, Appl. Phys. Lett. 0003-6951 75, 4001 (1999). 10.1063/1.125519
-
(1999)
Appl. Phys. Lett.
, vol.75
, pp. 4001
-
-
Klein, T.M.1
Niu, D.2
Epling, W.S.3
Li, W.4
Maher, D.M.5
Hobbs, C.C.6
Hegde, R.I.7
Baumvol, I.J.R.8
Parsons, G.N.9
-
10
-
-
36048938960
-
2 on SiC by dry thermal oxidation: Mechanisms
-
DOI 10.1088/0022-3727/40/20/S10, PII S0022372707432284
-
I. Vickridge, J. Ganem, Y. Hoshino, and I. Trimaille, J. Phys. D 0022-3727 40, 6254 (2007). 10.1088/0022-3727/40/20/S10 (Pubitemid 350093014)
-
(2007)
Journal of Physics D: Applied Physics
, vol.40
, Issue.20
, pp. 6254-6263
-
-
Vickridge, I.1
Ganem, J.2
Hoshino, Y.3
Trimaille, I.4
-
11
-
-
0037085882
-
-
0163-1829,. 10.1103/PhysRevB.65.121303
-
E. B. O. da Rosa, I. J. R. Baumvol, J. Morais, and R. M. C. de Almeida, Phys. Rev. B 0163-1829 65, 121303 (2002). 10.1103/PhysRevB.65.121303
-
(2002)
Phys. Rev. B
, vol.65
, pp. 121303
-
-
Da Rosa, E.B.O.1
Baumvol, I.J.R.2
Morais, J.3
De Almeida, R.M.C.4
-
12
-
-
0031547317
-
-
0169-4332,. 10.1016/S0169-4332(96)00805-7
-
S. Miyazaki, H. Nishimura, M. Fukuda, L. Ley, and J. Ristein, Appl. Surf. Sci. 0169-4332 114, 585 (1997). 10.1016/S0169-4332(96)00805-7
-
(1997)
Appl. Surf. Sci.
, vol.114
, pp. 585
-
-
Miyazaki, S.1
Nishimura, H.2
Fukuda, M.3
Ley, L.4
Ristein, J.5
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