Sputtered encapsulation as wafer level packaging for isolatable MEMS devices: A technique demonstrated on a capacitive accelerometer

Sensors

Volumn 8, Issue 11, 2008, Pages 7438-7452

  Hamzah, Azrul Azlan ^a   Yunas, Jumril ^a   Majlis, Burhanuddin Yeop ^a   Ahmad, Ibrahim ^b  

^a INSTITUTE OF MICROENGINEERING AND NANOELECTRONICS IMEN   (Malaysia)

^b UNIVERSITI KEBANGSAAN MALAYSIA   (Malaysia)

Author keywords

Capacitive accelerometer; Liquid crystal polymer; Silicon encapsulation; Sputtering; Wafer level packaging

Indexed keywords

CAPACITANCE TEST; CAPACITIVE ACCELEROMETERS; CMOS COMPATIBLE; NANOINDENTATION TESTS; SACRIFICIAL LAYER; STRUCTURAL LAYERS; SURFACE PROFILES; WAFER LEVEL PACKAGING;

LIQUID CRYSTAL POLYMERS; SCANNING ELECTRON MICROSCOPY; SILICON; SPIN GLASS; SPUTTERING;

ACCELEROMETERS;

EID: 68249109119     PISSN: 14248220     EISSN: None     Source Type: Journal    
DOI: 10.3390/s8117438     Document Type: Article

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