메뉴 건너뛰기




Volumn 15, Issue 7, 2009, Pages 1067-1071

Micro-structures fabrication on glasses for micro-fluidics by imprinting technique

Author keywords

[No Author keywords available]

Indexed keywords

BEFORE AND AFTER; BONDED INTERFACE; BONDING STRENGTH; DIRECT BONDING; GLASS SLABS; IMPRINTING TECHNIQUE; LOW COSTS; MASS PRODUCTION; MICRO-FLUIDIC DEVICES; SEM; SHEAR STRENGTH TESTS; SODA LIME GLASS; SURFACE PROFILOMETER;

EID: 67650438930     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-009-0881-7     Document Type: Article
Times cited : (12)

References (16)
  • 1
    • 67650404030 scopus 로고    scopus 로고
    • PhD Thesis, Electronic Devices, POLITECNICO DI TORINO, Italy
    • Chen Q (2008) PhD Thesis, Electronic Devices, POLITECNICO DI TORINO, Italy
    • (2008)
    • Chen Q1
  • 4
    • 38649132943 scopus 로고    scopus 로고
    • Fabrication and direct bonding of photosensitive multi-component silicate glasses for lossless planar waveguide splitter
    • 10.1016/j.jnoncrysol.2006.11.045
    • Q Chen D Milanese Q Chen M Ferraris 2008 Fabrication and direct bonding of photosensitive multi-component silicate glasses for lossless planar waveguide splitter J Non-Cryst Solids 354 1230 1234 10.1016/j.jnoncrysol.2006.11.045
    • (2008) J Non-Cryst Solids , vol.354 , pp. 1230-1234
    • Chen, Q.1    Milanese, D.2    Chen, Q.3    Ferraris, M.4
  • 5
    • 18844379690 scopus 로고    scopus 로고
    • Crack-Free direct-writing on glass using a low power UV laser in the manufacture of a microfluidic chip
    • J-Y Cheng 2005 Crack-Free direct-writing on glass using a low power UV laser in the manufacture of a microfluidic chip J Micromech Microeng 15 1147 1156
    • (2005) J Micromech Microeng , vol.15 , pp. 1147-1156
    • Cheng, J.-Y.1
  • 6
    • 0348197032 scopus 로고    scopus 로고
    • Nanofluidic channels with elliptical cross sections formed using a nonlithographic process
    • 10.1063/1.1633008
    • DA Czaplewski J Kameoka R Mathers GW Coates 2003 Nanofluidic channels with elliptical cross sections formed using a nonlithographic process Appl Phys Lett 83 4836 4838 10.1063/1.1633008
    • (2003) Appl Phys Lett , vol.83 , pp. 4836-4838
    • Czaplewski, D.A.1    Kameoka, J.2    Mathers, R.3    Coates, G.W.4
  • 9
    • 57249101859 scopus 로고    scopus 로고
    • Micro/nanoimprinting of glass under high temperature using a CVD diamond mold
    • (9pp)
    • M Komori H Uchiyama H Takebe T Kusuura 2008 Micro/nanoimprinting of glass under high temperature using a CVD diamond mold J Micromech Microeng 18 6 065013 (9pp)
    • (2008) J Micromech Microeng , vol.18 , Issue.6 , pp. 065013
    • Komori, M.1    Uchiyama, H.2    Takebe, H.3    Kusuura, T.4
  • 10
    • 4344702861 scopus 로고    scopus 로고
    • Fabrication of nanofluidic devices using glass-to-glass anodic bonding
    • VG Kutchoukov F Laugere W Vander Vlist 2004 Fabrication of nanofluidic devices using glass-to-glass anodic bonding J Non-Cryst Solids 114 521 527
    • (2004) J Non-Cryst Solids , vol.114 , pp. 521-527
    • Kutchoukov, V.G.1    Laugere, F.2    Vander Vlist, W.3
  • 11
    • 0033345095 scopus 로고    scopus 로고
    • Effects of a hydrophilic surface in anodic bonding
    • 10.1088/0960-1317/9/4/305
    • DJ Lee BK Ju J Jang 1999 Effects of a hydrophilic surface in anodic bonding J Micromech Microeng 9 313 318 10.1088/0960-1317/9/4/305
    • (1999) J Micromech Microeng , vol.9 , pp. 313-318
    • Lee, D.J.1    Ju, B.K.2    Jang, J.3
  • 12
    • 0035971924 scopus 로고    scopus 로고
    • Microwave bonding of polymer-based substrates for potential encapsulated micro/nanofluidic device fabrication
    • 10.1016/S0925-4005(00)00745-0
    • G-B Lee S-H Chen G-R Huang 2001 Microwave bonding of polymer-based substrates for potential encapsulated micro/nanofluidic device fabrication Sens Actuators B Chem 75 142 148 10.1016/S0925-4005(00)00745-0
    • (2001) Sens Actuators B Chem , vol.75 , pp. 142-148
    • Lee G-B1    Chen S-H2    Huang G-R3
  • 13
    • 18744363890 scopus 로고    scopus 로고
    • The promise of nanotechnology for separation devices-from a top-down approach to nature-inspired separation devices
    • D Mijatovic 2005 The promise of nanotechnology for separation devices-from a top-down approach to nature-inspired separation devices Lab Chip 5 492 500
    • (2005) Lab Chip , vol.5 , pp. 492-500
    • Mijatovic, D.1
  • 14
    • 0034249327 scopus 로고    scopus 로고
    • Development of novel low temperature bonding technologies for microchip chemical analysis application
    • 10.1016/S0924-4247(99)00346-5
    • A Sayah D Solignac T Cueni 2000 Development of novel low temperature bonding technologies for microchip chemical analysis application J Sens Actuators 84 103 108 10.1016/S0924-4247(99)00346-5
    • (2000) J Sens Actuators , vol.84 , pp. 103-108
    • Sayah, A.1    Solignac, D.2    Cueni, T.3
  • 15
    • 9744270951 scopus 로고    scopus 로고
    • Wafer bonding and layer splitting for microsystems
    • Q-Y Tong UM Gosele 1999 Wafer bonding and layer splitting for mcirosystems J Adv Mater 17 1409 1425 (Pubitemid 129675576)
    • (1999) Advanced Materials , vol.11 , Issue.17 , pp. 1409-1425
    • Tong, Q.-Y.1    Gosele, U.M.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.