Effects of a hydrophilic surface in anodic bonding

Journal of Micromechanics and Microengineering

Volumn 9, Issue 4, 1999, Pages 313-318

  Lee, Duck Jung ^a   Ju, Byeong Kwon ^a   Jang, Jin ^b   Lee, Kwang Bae ^c   Oh, Myung Hwan ^a  

^a Korea Institute of Science and Technology   (South Korea)

^b Kyung Hee University   (South Korea)

^c Sangji University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (CHEMICAL); ELECTROSTATICS; GLASS; HYDROGEN BONDS; HYDROGEN PEROXIDE; SECONDARY ION MASS SPECTROMETRY; SILICON WAFERS; WATER;

ANODIC BONDING; HYDROPHILICITY;

BONDING;

EID: 0033345095     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/9/4/305     Document Type: Article

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