Material fatigue and reliability of MEMS accelerometers

Proceedings - IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems

Volumn , Issue , 2008, Pages 314-322

  Xiong, Xingguo ^a   Wu, Yu Liang ^b   Jone, Wen Ben ^c  

^a UNIVERSITY OF BRIDGEPORT   (United States)

^b CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

^c University of Cincinnati   (United States)

Author keywords

Failure analysis; Material fatigue; MEMS accelerometer; Redundancy repair; Reliability

Indexed keywords

CYCLING LOAD; DEVICE FAILURES; DEVICE RELIABILITY; ENERGY DOMAIN; FAILURE MECHANISM; FAILURE RATE; FATIGUE LIFETIME; GENERAL PURPOSE; MATERIAL FATIGUE; MEAN TIME TO FAILURE; MEMS (MICROELECTROMECHANICAL SYSTEM); MEMS ACCELEROMETER; MEMS MATERIALS; MEMS RELIABILITY; MEMSDEVICES; POTENTIAL THREATS; REDUNDANCY REPAIR; RELIABILITY IMPROVEMENT; SAFETY CRITICAL APPLICATIONS; SELF-REPAIRABLE; SIMULATION RESULT; STRESS SIMULATIONS; STRUCTURE DEFECTS;

ACCELEROMETERS; COMPOSITE MICROMECHANICS; DEFECTS; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FAULT TOLERANCE; FAULT TOLERANT COMPUTER SYSTEMS; MATERIALS; MEMS; MICROELECTROMECHANICAL DEVICES; POLYSILICON; PROBABILITY DENSITY FUNCTION; REDUNDANCY; RELIABILITY ANALYSIS; REPAIR; SAFETY FACTOR;

QUALITY ASSURANCE;

EID: 67649966617     PISSN: 15505774     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DFT.2008.37     Document Type: Conference Paper

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